A maximum of 3 cameras and 2 lasers can be selected and installed. Direct docking with an advanced function tester or cable docking using a manipulator or probe card is selectable. A simple stage for 300 mm wafers is available. A flexible system structure including a laser application option allows you to perform a variety of backside analysis while using many types of detectors.
LCD monitor lamp(s) contains mercury, dispose according to local, state or federal laws.
● Multi-camera platform with high-precision stage
● Flexible system design
● Multiple detectors suitable for observing low voltage operating IC
● Variety of lens selection from 1× to 100× (Optional 10-lens turret available.)
● Backside observation prober available for measurements from an entire 300 mm wafer to a single die
● Simplified tester head docking for dynamic analysis
● User friendly operation system
● Easily upgradable for future application
● High-resolution pattern image by confocal microscope