ASAP-1 Analog Selected Area Preparation System

Since product launch of the original hardware, ASAP-1® has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis have come to rely on for backside preparation.

In recent years, driven by exponential growth of newer packaging types; CSP, MCM, BGA, flip chip to name a few; in addition to ever more demanding analytical methods, ASAP-1®'s application array has been expanded to enable mechanical decapsulation and topside de-processing.

The 2nd Generation ASAP-1® models provide the same intelligent engineering approach and intuitive user interface, whilst incorporating advanced optical sample alignment and high torque motor options to handle the most 'difficult' sample preparations. Aesthetics and system access have also bee in proved to enhance the ease of use.

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