ULTRA TEC MULTIPOL Advance
MULTIPOL Advance is a versatile lapping and polishing systems capable of preparing some of the most demanding specimens required by Research and Industry.
Maintain sample integrity
A drip cup travels with the probe as it moves over the sample tubes to collect any sample droplets, preventing cross contamination.
Sample mixing is accomplished by close proximity, high acceleration diluent addition. This concussive mixing method works well across a wide range of sample types. Ensuring homogeneity prior to analysis is critical to data quality.
Customize sample routinesThe OilEase software makes it easy to create custom methods and apply them to specific samples in a sequence. This means you can be confident in your data quality because the method matches the sample type.
The onboard density correction option adjusts the volume of sample diluent added to account for the density difference in standard and diluent solutions. This allows users to maintain optimal speed while improving sample accuracy.
The robust build of the APS-7450V system ensures long,reliable performance with light routine maintenance.
MULTIPOL Advance is a versatile lapping and polishing systems capable of preparing some of the most demanding specimens required by Research and Industry.
ULTRAPOL Basic lapping and polishing machine offers the build-quality required for high precision manual polishing of materials for production, research and NAND flash chip-off in digital forensics — at an extremely affordable price.
OptiPMD determines the boiling range characteristics of petroleum products in less than 10 minutes, using only 10 ml of sample and it’s included in at least 10 fuel specifications.
The MESA-7220V2 measures both sulfur and chlorine in petroleum based products using the Monochromatic Energy Dispersive X-ray Fluorescence (EDXRF) method.
Based on many years of customer input and product development, ASAP-1® IN SITU is a single-footprint milling and sample prep system that can incorporate RST Measurement System –allowing measurement of the thickness of remaining silicon without sample transfer.
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