FLAT AND ANGLED PREPARATION OF OPTICAL, ELECTRONIC & MATERIALOGRAPHIC COMPONENTS

ULTRAPOL End & Edge Polisher has been designed to provide accurate lapping and polishing for research and industrial applcations. Several thousand of these units are already assisting users in a wide range of technical disciplines.

Key Industries: Semiconductor and Electronics and more.
  • Fully Angle adjustable – produces specific wedge angles
  • Quick Release Interface allow for fast and repeatable mounting and demounting.
  • Holders available for most components
  • Fast process times
  • Low run-out lap for flat optical polishes

The specific workholder for an application is held firmly and repeatably with the system’s quick release interface. Standard holders are available for many applications, including:

  • Capillary / glass ferrule polishing
  • Planar Waveguide polishing
  • Bare fiber polishing – flat and angle polishing
  • Integrated optics
  • Die Cross-sectioning
  • SEM and TEM sample preparation
  • IC Wafer and package-level backside preparation
  • Encapsulated mount polishing

Features
  • Fully Angle adjustable – produces specific wedge angles
  • Quick Release Interface allow for fast and repeatable mounting and demounting.
  • Holders available for most components
  • Fast process times
  • Low run-out lap for flat optical polishes

The specific workholder for an application is held firmly and repeatably with the system’s quick release interface. Standard holders are available for many applications, including:

  • Capillary / glass ferrule polishing
  • Planar Waveguide polishing
  • Bare fiber polishing – flat and angle polishing
  • Integrated optics
  • Die Cross-sectioning
  • SEM and TEM sample preparation
  • IC Wafer and package-level backside preparation
  • Encapsulated mount polishing

Related Products

Ultraslice Macrotome is a low-cost sectioning system designed for mobile chips, devices, and various industrial samples. This system is known for its precision and versatility.
The iPHEMOS-MPX is a high-resolution Inverted Emission Microscope that pinpoints failure locations in semiconductor devices by detecting the weak light emissions and heat emissions caused by defects.
IR-2200 Microscope System enables the user to inspect sub-surface images including MEMS device, 3D stacks, incoming wafers, photovoltaic and wafer level CSP’s with an astonishing level of precision.
The AFM100 Series is Hitachi’s next generation probe microscopy platform.
PHI’s Latest Generation of TOF-SIMS, having a Modern Ergonomic Package, Smaller Footprint, and Advanced Features
DSC is used to measure heat flow for material characterization by providing thermal properties such as melting point, glass transition and crystallization.
The only scanning Auger nanoprobe in the world that guarantees a field emission electron source whose spatial resolution is 8 nm or less.
Hitachi’s DMA is the perfect tool for assessing both stiff and soft samples, while also capturing rapid modulus changes.
This new generation of the long-standing Hitachi tabletop microscopes (TM) integrates ease of use, optimized imaging, and high-image quality, while maintaining compact design
The Insight-Scan (IS) series of Scanning Acoustic Microscopes(SAM) integrates the finest state-of-the-art technology for high resolution, high speed, fully digital non-destructive sample analysis.

How can we help?

You may contact our specialists by accomplishing form below.

failure analysis, material characterization, and metrology equipment

Subscribe to newsletter

Sign up for our newsletter to get updates on promos, seminars, events, products, application notes and more.

Inquire for this Product

Ultrapol Advance
Flat Lapping and Polishing Machine
Ultrapol Advance
Flat Lapping and Polishing Machine