FLAT AND ANGLED PREPARATION OF OPTICAL, ELECTRONIC & MATERIALOGRAPHIC COMPONENTS

ULTRAPOL End & Edge Polisher has been designed to provide accurate lapping and polishing for research and industrial applcations. Several thousand of these units are already assisting users in a wide range of technical disciplines.

Key Industries: Semiconductor and Electronics and more.
  • Fully Angle adjustable – produces specific wedge angles
  • Quick Release Interface allow for fast and repeatable mounting and demounting.
  • Holders available for most components
  • Fast process times
  • Low run-out lap for flat optical polishes

The specific workholder for an application is held firmly and repeatably with the system’s quick release interface. Standard holders are available for many applications, including:

  • Capillary / glass ferrule polishing
  • Planar Waveguide polishing
  • Bare fiber polishing – flat and angle polishing
  • Integrated optics
  • Die Cross-sectioning
  • SEM and TEM sample preparation
  • IC Wafer and package-level backside preparation
  • Encapsulated mount polishing

Features
  • Fully Angle adjustable – produces specific wedge angles
  • Quick Release Interface allow for fast and repeatable mounting and demounting.
  • Holders available for most components
  • Fast process times
  • Low run-out lap for flat optical polishes

The specific workholder for an application is held firmly and repeatably with the system’s quick release interface. Standard holders are available for many applications, including:

  • Capillary / glass ferrule polishing
  • Planar Waveguide polishing
  • Bare fiber polishing – flat and angle polishing
  • Integrated optics
  • Die Cross-sectioning
  • SEM and TEM sample preparation
  • IC Wafer and package-level backside preparation
  • Encapsulated mount polishing

Related Products

Hitachi’s DMA is the perfect tool for assessing both stiff and soft samples, while also capturing rapid modulus changes.
Hitachi High-Tech’s scanning electron microscopes SU3800/SU3900 deliver both operability and expandability. The operator can automate many operations and efficiently utilize their high performance.
ASAP-1® has become the standard preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis.
DSC is used to measure heat flow for material characterization by providing thermal properties such as melting point, glass transition and crystallization.
The AFM100 Series is Hitachi’s next generation probe microscopy platform.
STA (simultaneous thermogravimetric analysis) measures DSC and TGA simultaneously in a single unit.
ULTRAPOL Basic lapping and polishing machine offers the build-quality required for high precision manual polishing of materials for production, research and NAND flash chip-off in digital forensics
With options for both oxidizing and non-oxidizing metals, as well as carbon evaporation, Quorum coaters are suitable for applications, including high-resolution SEM and FIB-SEM, ensuring precise resu
The SU8600 incorporates a highbrightness cold-field emitter (CFE) to allow acquisition of ultra-high-resolution images even at low accelerating voltages.
IR-2200 Microscope System enables the user to inspect sub-surface images including MEMS device, 3D stacks, incoming wafers, photovoltaic and wafer level CSP’s with an astonishing level of precision.

How can we help?

You may contact our specialists by accomplishing form below.

failure analysis, material characterization, and metrology equipment

Subscribe to newsletter

Sign up for our newsletter to get updates on promos, seminars, events, products, application notes and more.

Inquire for this Product

Ultrapol Advance
Flat Lapping and Polishing Machine
Ultrapol Advance
Flat Lapping and Polishing Machine