Failure Analysis, Material Characterization, Metrology Equipment

Semiconductor Inspection System

Infrared Microscope

IR-2200

The IR-2200 Infrared Microscope system integrates the infrared table top microscope system with software and 4.1 Megapixel USB-3.0 NIR Camera.

Capable of high precision measurements, image capture, verification and inspection of materials transparent to the near infrared (NIR) / Shortwave Infrared (SWIR) wavelengths.

The IR-2200 Infrared Microscope system integrates the infrared table top microscope system with software and 4.1 Megapixel USB-3.0 NIR Camera.

Capable of high precision measurements, image capture, verification and inspection of materials transparent to the near infrared (NIR) / Shortwave Infrared (SWIR) wavelengths.

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IR-2200 Microscope System enables the user to inspect sub-surface images including MEMS device, 3D stacks, incoming wafers, photovoltaic and wafer level CSP’s with an astonishing level of precision.

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IR-2200

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SU8600

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Ultra High Resolution Cold-FESEM

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NEXTA DSC

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Differential Scanning Calorimeter

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DSC is used to measure heat flow for material characterization by providing thermal properties such as melting point, glass transition and crystallization.

DSC is used to measure heat flow for material characterization by providing thermal properties such as melting point, glass transition and crystallization.

PHI 710

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Auger Electron Spectroscopy (AES, SAM)

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SU9000

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K975X

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NEXTA STA Series

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SU3800 / SU3900

SU3800 / SU3900

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Hitachi High-Tech’s scanning electron microscopes SU3800/SU3900 deliver both operability and expandability. The operator can automate many operations and efficiently utilize their high performance.