Seiwa Optical Semiconductor Auto Review System

Semiconductor Auto Review System

This equipment is for automated optical inspection system for semiconductor device wafers.
By using On-Fly measurement mode, system perform high speed and high accuracy
visual inspection for such as pattern defects, contamination, cracks.

This equipment is for automated optical inspection system for semiconductor device wafers.
By using On-Fly measurement mode, system perform high speed and high accuracy
visual inspection for such as pattern defects, contamination, cracks.

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Ultraslice Macrotome

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Ultraslice Macrotome is a low-cost sectioning system designed for mobile chips, devices, and various industrial samples. This system is known for its precision and versatility.

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ULTRAPOL Basic

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ULTRAPOL Basic lapping and polishing machine offers the build-quality required for high precision manual polishing of materials for production, research and NAND flash chip-off in digital forensics

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IR-2200

Infrared Microscope

IR-2200 Microscope System enables the user to inspect sub-surface images including MEMS device, 3D stacks, incoming wafers, photovoltaic and wafer level CSP’s with an astonishing level of precision.

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SU8600

Ultra High Resolution Cold-FESEM

The SU8600 incorporates a highbrightness cold-field emitter (CFE) to allow acquisition of ultra-high-resolution images even at low accelerating voltages.

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Semiconductor Auto Review System

Solution for the review of defects of semiconductor integrated circuit detected by AOI/AVI at front end processing, helps to eliminate false defects and increase overall yield.

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Semiconductor Auto Review System

This equipment is for automated optical inspection system for semiconductor device wafers. By using On-Fly measurement mode, system perform high speed and high accuracy visual inspection for such as pattern defects, contamination, cracks.

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This equipment is for automated optical inspection system for semiconductor device wafers.
By using On-Fly measurement mode, system perform high speed and high accuracy
visual inspection for such as pattern defects, contamination, cracks.