Seiwa Optical Wafer Inspection System

Wafer Inspection System

Seiwa Wafer review system visually inspects the defect location detected from AOI systems. By importing the inspection system data results from the AOL, this review system is able to capture the visual data and add it to previous inspection results.

Key Industries: Semiconductor and Electronics and more.

Seiwa Wafer inspection system visually inspects the defect location detected from AOI systems. By importing the inspection system data results from the AOL, this review system is able to capture the visual data and add it to previous inspection results.

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IM4000Plus

Ion Milling System

The IM4000Plus Ion Milling System utilizes a broad, low-energy Ar+ ion beam milling method to produce wider, undistorted cross-section milling or flat milling.

nanoTOF II

Time-of-flight Secondary Ion Mass Spectroscope (TOF-SIMS)

PHI’s Latest Generation of TOF-SIMS, having a Modern Ergonomic Package, Smaller Footprint, and Advanced Features

AFM100

Multifunctional Probe Atomic Force Microscope

The AFM100 Series is Hitachi’s next generation probe microscopy platform.

SU8600

Ultra High Resolution Cold-FESEM

The SU8600 incorporates a highbrightness cold-field emitter (CFE) to allow acquisition of ultra-high-resolution images even at low accelerating voltages.

NEXTA STA Series

Simultaneous Thermogravimetric Analyzer (DSC-TGA)

STA (simultaneous thermogravimetric analysis) measures DSC and TGA simultaneously in a single unit.

SU3800 / SU3900

Scanning Electron Microscope

Hitachi High-Tech’s scanning electron microscopes SU3800/SU3900 deliver both operability and expandability. The operator can automate many operations and efficiently utilize their high performance.

SU9000

Ultra-high Resolution Scanning Electron Microscope

The Cold Field Emission source is ideal for high-resolution imaging with a small source size and energy spread. Innovative CFE Gun technology contributes the ultimate FE-SEM with superior beam bright

ASAP-1

Selected Area Preparation System

ASAP-1® has become the standard preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis.

IR-2200

Infrared Microscope

IR-2200 Microscope System enables the user to inspect sub-surface images including MEMS device, 3D stacks, incoming wafers, photovoltaic and wafer level CSP’s with an astonishing level of precision.

IS-202

Scanning Acoustic Microscope

The IS-202 Scanning Acoustic Microscope combines highest resolution with a very compact mechanical set-up.

Wafer Inspection System

Seiwa Wafer review system visually inspects the defect location detected from AOI systems. By importing the inspection system data results from the AOL, this review system is able to capture the visual data and add it to previous inspection results.

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