LOW COST SECTIONING SYSTEM FOR MOBILE CHIPS, DEVICES & INDUSTRY SAMPLES

  • Suits Low Budgets
  • Manual Crank Table Feed, with motor option
  • Z-Spindle Option adds easy ability to adapt to sample height
  • Chip-Off for Digital Forensics
  • Fish & Game Samples
  • Industrial Samples
Key Industries: Lenses, Mining, Semiconductor and Electronics and more.

ULTRA TEC Ultraslice Macrotome Precision Diamond Saw | LOW COST SECTIONING SYSTEM FOR MOBILE CHIPS & DEVICES

ULTRASLICE Macrotome precision diamond saw has a quiet, safe, direct drive design for smooth, chatter free slicing system for important and fragile industrial samples. The system is perfect for the sectioning of cellphone devices and components to allow for downstream chip-off techniques with our milling and polishing equipment. MACROTOME suits many other industrial applications.  If you have such an “other” application, talk to us about it and we can confirm suitability – perhaps by cutting samples.  Macrotome may represent a low cost solution for you. The wheel (spindle) rotation is variable speed, to allow for optimized cut quality. An easy access coolant reservoir, allows for efficient coolant changes.

ULTRA TEC Ultraslice Macrotome Precision Diamond Saw

For quotation and more info, contact us.

Product Brochure

Features

LOW COST SECTIONING SYSTEM FOR MOBILE CHIPS & DEVICES

ULTRASLICE Macrotome precision diamond saw has a quiet, safe, direct drive design for smooth, chatter free slicing system for important and fragile industrial samples. The system is perfect for the sectioning of cellphone devices and components to allow for downstream chip-off techniques with our milling and polishing equipment. MACROTOME suits many other industrial applications.  If you have such an “other” application, talk to us about it and we can confirm suitability – perhaps by cutting samples.  Macrotome may represent a low cost solution for you. The wheel (spindle) rotation is variable speed, to allow for optimized cut quality. An easy access coolant reservoir, allows for efficient coolant changes.

Product Brochure

Related Products

IR-2200 Microscope System enables the user to inspect sub-surface images including MEMS device, 3D stacks, incoming wafers, photovoltaic and wafer level CSP’s with an astonishing level of precision.
PHI’s Latest Generation of TOF-SIMS, having a Modern Ergonomic Package, Smaller Footprint, and Advanced Features
The FlexSEM 1000 II VP-SEM combines innovative technological features with an intuitive interface, to deliver adaptability and flexibility in a powerful, automated, lab-friendly package.
The SU8600 incorporates a highbrightness cold-field emitter (CFE) to allow acquisition of ultra-high-resolution images even at low accelerating voltages.
Hitachi’s DMA is the perfect tool for assessing both stiff and soft samples, while also capturing rapid modulus changes.
Hitachi High-Tech’s scanning electron microscopes SU3800/SU3900 deliver both operability and expandability. The operator can automate many operations and efficiently utilize their high performance.
The PHEMOS-X is a high-resolution emission microscope that pinpoints failure locations in semiconductor devices by detecting the weak light emissions and heat emissions caused by defects.
The SU7000 is the ultimate high-performance all-rounder: an ultra high resolution Schottky FESEM offering nanoscale imaging and powerful analysis
The AFM100 Series is Hitachi’s next generation probe microscopy platform.
The IM4000Plus Ion Milling System utilizes a broad, low-energy Ar+ ion beam milling method to produce wider, undistorted cross-section milling or flat milling.

How can we help?

You may contact our specialists by accomplishing form below.

failure analysis, material characterization, and metrology equipment

Subscribe to newsletter

Sign up for our newsletter to get updates on promos, seminars, events, products, application notes and more.

Inquire for this Product

Ultraslice Macrotome
Precision Diamond Saw
Ultraslice Macrotome
Precision Diamond Saw