Powerful scan technology
- High speed technology: 1000 mm/sec scan speed, 500 MHz receiver bandwidth, 3 GHz data sampling rate
- Dual channel data acquisition for minimizing the acquisition time on one sample, or for simultaneous data acquisition on 2 different samples
- Simultaneous pulse-echo and through transmission acquisition supported
- Up to 6 axis control, including 2-fold transducer tilt for wedge and contour scans
Advanced software features
- Real time full waveform acquisition: Collected data allow offline rescanning of the sample with different gate settings
- Advanced analysis features: Generation of virtual B-scans and tomographic C-scans from stored data files
- Slice scan for acquisition of a virtually unlimited number of C-scans on different depth levels simultaneously
- Multi-lingual software in English, Japanese, Chinese, French, German, …
Wide application range
Semiconductor and microelectronics
- CSP and Flip Chip underfil void evaluation and delamination analysis
- Power semiconductor integrity evaluation
- Internal defect inspection: Inclusions, cracks, die tilt
- Interface evaluation of bonded wafers
Material analysis
- Inclusion, crack and void detection in metals, plastics, resin
Interface analysis
- Void evaluation in welds and brazed interfaces
- Electrostatic chuck void detection
- Delamination of composite materials
- Interface analysis on heterogeneous assembled materials
