Failure Analysis,
Material Characterization and Metrology Equipment
Scanning Electron Microscopes, Transmission Electron Microscopes, Atomic Force Microscopes, Thermal Analyzers, Failure Analysis Systems, Sample Preparation Equipment, Scanning Acoustic Microscopes, Optical Microscopes, X-Ray Photoelectron Spectroscopy, Auger Electron Spectroscopy, and more.
This new generation of the long-standing Hitachi tabletop microscopes (TM) integrates ease of use, optimized imaging, and high-image quality, while maintaining compact design
The PHEMOS-X is a high-resolution emission microscope that pinpoints failure locations in semiconductor devices by detecting the weak light emissions and heat emissions caused by defects.
The IM4000Plus Ion Milling System utilizes a broad, low-energy Ar+ ion beam milling method to produce wider, undistorted cross-section milling or flat milling.
The MC1000 Ion Sputter Coater is a sample preparation instrument for use with a Scanning Electron Microscope (SEM) designed to deposit a thin metal coating, such as platinum (Pt), gold (Au), platinum-
Hitachi High-Tech’s scanning electron microscopes SU3800/SU3900 deliver both operability and expandability. The operator can automate many operations and efficiently utilize their high performance.
Ethos offers powerful solutions integrated into a single platform including low-acceleration Ar/Xe ion-beam processing when configured as a Triple-Beam system.
The SU8600 incorporates a highbrightness cold-field emitter (CFE) to allow acquisition of ultra-high-resolution images even at low accelerating voltages.
DSC is used to measure heat flow for material characterization by providing thermal properties such as melting point, glass transition and crystallization.
The Cold Field Emission source is ideal for high-resolution imaging with a small source size and energy spread. Innovative CFE Gun technology contributes the ultimate FE-SEM with superior beam bright
The ZONESEMⅡ Tabletop Sample Cleaner uses UV-based cleaning technology to minimize or eliminate hydrocarbon contamination for electron microscopy imaging.
The iPHEMOS-MPX is a high-resolution Inverted Emission Microscope that pinpoints failure locations in semiconductor devices by detecting the weak light emissions and heat emissions caused by defects.
Ultraslice Macrotome is a low-cost sectioning system designed for mobile chips, devices, and various industrial samples. This system is known for its precision and versatility.
ULTRAPOL Basic lapping and polishing machine offers the build-quality required for high precision manual polishing of materials for production, research and NAND flash chip-off in digital forensics
ASAP-1® has become the standard preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis.
With options for both oxidizing and non-oxidizing metals, as well as carbon evaporation, Quorum coaters are suitable for applications, including high-resolution SEM and FIB-SEM, ensuring precise resu
Solution for the review of defects of semiconductor integrated circuit detected by AOI/AVI at front end processing, helps to eliminate false defects and increase overall yield.
Seiwa Wafer review system visually inspects the defect location detected from AOI systems. This review system is able to capture the visual data and add it to previous inspection results.
IR-2200 Microscope System enables the user to inspect sub-surface images including MEMS device, 3D stacks, incoming wafers, photovoltaic and wafer level CSP’s with an astonishing level of precision.
The Insight-Scan (IS) series of Scanning Acoustic Microscopes(SAM) integrates the finest state-of-the-art technology for high resolution, high speed, fully digital non-destructive sample analysis.